3D Structured Light Stereo Depth Camera
The camera adopts active binocular vision technology with independent intellectual property rights, which is better than traditional binocular
Vision has more depth of field details and stronger environmental adaptability. The data information obtained can help the machine
Many fields such as people, industry, commerce and consumption realize intelligence.
This series uses an aluminum alloy body, a sturdy structure, and can be applied to a variety of harsh
Industrial use scenarios.
With more than 10 years of PCB manufacturing experience, KingSong provides high-reliability products and provides our customers with high-value, high-quality, and guaranteed quality production services.
With the vigorous development of industries such as artificial intelligence, in the intelligent hardware devices, 3D visual perception has become a bottleneck restricting the development of many intelligent fields due to imaging technology problems. In order to reduce the threshold and realize the vision of 3D imaging technology popularizing on smart terminal devices, a depth camera based on structured light 3D imaging technology can acquire high-resolution, high-precision depth images in real time. Dedicated to create a cost-effective, soft and hard integrated solution
3D camera product solution.”
Our company aims to make all terminals understand the world. The company’s 3D sensor camera enables hardware devices to have a pair of “eyes of wisdom” that sense the environment, and has dozens of functions such as face recognition,gesture recognition, human skeleton recognition, 3D measurement, environment perception, and 3D map reconstruction. Widely used in television, mobile phones,robots, drones, logistics,VR/AR, smart home security, car driving assistance and other fields.
Detail Specification:
| Item | Mass Production | Prototype |
| Layers | 1-8 Layers | 1-36 Layers |
| Max. Panel Size | 600*770mm( 23.62″*30.31″) | 600*770mm(23.62″*30.31″) 500*1200mm(19.69″*47.24″) |
| Max.Board Thickness | 8.5mm | 8.5mm |
| Min. Board Thickness | 2L:0.3mm, 4L:0.4mm, 6L:0.8mm |
2L:0.2mm, 4L:0.4mm. 6L:0.6mm |
| Min Inner Layer Clearance | 0.1mm(4mil) | 0.1mm(4mil) |
| Min Line width | 0.075mm(3/3 mil) | 0.075mm(3/3 mil) |
| Min Line space | 0.075mm(3/3 mil) | 0.075mm(3/3 mil) |
| Min.Hole Size | 0.15mm(6mil) | 0.15mm(6mil) |
| Min plated hole thickness | 20um(0.8mil) | 20um(0.8mil) |
| Min Blind/Buried hole size | 0.1mm(4mil) | 0.1mm(1-8layers)(4mil) |
| PTH Dia. Tolerance | ±0.076mm(±3mil) | ±0.076mm(±3mil) |
| Non PTH Dia. Tolerance | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| Hole Position Deviation | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| Heavy Coppe | 4oz/140μm | 6oz/175μm |
| Min S/M Pitch | 0.1mm (4mil) | 0.1mm (4mil) |
| Soldermask colour | Green,black,Blue,White,Yellow,Red | Green,black,Blue,White,Yellow,Red |
| Silkscreen colour | White,Yellow,Red,Black | White,Yellow,Red,Black |
| Outline | Routing,V-Groove, Beveling punch | Routing,V-Groove, Beveling punch |
| Outline Tolerance | ±0.15mm ±6mil | ±0.15mm (±6mil) |
| Peelable mask | Top,bottom,double sided | Top,bottom,double sided |
| Controlled Impedance | +/- 10% | +/- 7% |
| Insulation Resistance | 1×1012Ω(Normal) | 1×1012Ω(Normal) |
| Through Hole Resistance | <300Ω(Normal) | <300Ω(Normal) |
| Thermal Shock | 3×10sec@288℃ | 3×10sec@288℃ |
| Warp and Twist | ≤0.7% | ≤0.7% |
| Electric Strength | >1.3KV/mm | >1.4KV/mm |
| Peel Strength | 1.4N/mm | 1.4N/mm |
| Solder Mask Abrasion | >6H | >6H |
| Flammability | 94V-0 | 94V-0 |
| Test Voltage | 50-330V | 50-330V |
PCB lead time: (if you need urgent service,we also can meet)
| Description | Double Layer | 4 Layer | 6 Layer | 8 Layer | 10 Layer or above |
| Sample(WD) | 3 | 7 | 8 | 10 | 12 |
| Mass production(WD) | 7-9 | 10-12 | 13-15 | 16 | 20 |
Package:
The inner vacuum packing, Outer standard carton box packing.
Shipping:
1. By DHL, UPS, FedEx, TNT, etc.
2. By sea for mass quantity according to the customer’s requirement.
If you need a quotation for your PCB projects, please provide the following info:
1. Quote, quantity.
2. Gerber file in a 274-x format.
3. Technical requirement or parameters (material, layer, copper thickness, board thickness, surface finishing, solder mask/silkscreen color…).
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